PREFACE: Build a PC chassis that is based on the jet inlets commonly found on helicopter engines or the like. Use thermoelectric (TEC or Peltier) elements to create a below-freezing cooling engine. Employ liquid cooling to transfer the heat from the computer to the TEC cooling unit. Use air cooling to transfer the heat from the heat sinks on the TEC system to the outside air.
This isn't the first time that TEC-liquid cooling has been used in this way but I'm working on making a more visually appealing creation as well as a super fast (and cold) processing machine!

Here is the first 3D CAD model I created for initial visual impressions of the designs. This is based on a "PC cube" case design where the motherboard and slots are located on one half and all the 5.25" bays on the other. In this case, I will be using the drive bay side for cooling and re-locate all the necessary drives on the motherboard side.
(click on the image for a larger version)

I created two versions of this design. The first was to use two openings on the front side of the case and this would allow the air to flow in, make a U-turn, and come out. The second design was to run straight through the system. In the end, I've decided on the two front openings for the design as this works well with the internal heat sinks and also looks cooler!

12/04/02: I've made some updates to the 3D model to better show the look of the project as well as some of the working systems I'm planning...
(click on the image for a larger version)